Target substrate with micro semiconductor structures
US10872801B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Sep 5, 2018 |
| Grant date | Dec 22, 2020 |
| Priority date | — |
| Expiry date | Sep 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A target substrate with micro semiconductor structures is manufactured by following steps of: attaching a pre-adhesive layer on a target substrate; patterning the adhesive layer to form a plurality of micro contact protrusions; and using the target substrate to perform a selective batch pickup procedure to pick up a plurality of micro semiconductor structures so as to form the target substrate with micro semiconductor structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.