Bonding head and method for bonding semiconductor package, and semiconductor package
US10872875B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2019 |
| Grant date | Dec 22, 2020 |
| Priority date | — |
| Expiry date | Feb 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding a semiconductor package includes loading a semiconductor chip on a substrate, and bonding the semiconductor chip to the substrate by using a bonding tool, the bonding tool including a pressing surface for pressing the semiconductor chip, and an inclined surface extending from one side of the pressing surface. Bonding the semiconductor chip to the substrate includes deforming a bonding agent disposed between the substrate and the semiconductor chip by pressing the bonding tool, and deforming the bonding agent includes generating a fillet by protruding a portion of the bonding agent beyond the semiconductor chip, and growing the fillet in such a way that a top surface of the fillet is grown in an extending direction of the inclined surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.