Die mechanism, apparatus, and method for shaping a component for creep-age forming
US10875074B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2016 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Jul 11, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21D22/022
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A die mechanism comprises a first support member and a second support member, the first and second support members extending in a first direction; a plurality of pin modules between the first and second support members, wherein each of the plurality of pin modules extends in a second direction perpendicular to the first direction, and each pin module comprises a plurality of pins; wherein heights of ends of the plurality of pins within each of the plurality of pin modules together define a shape profile for shaping the component during creep-age forming; and wherein: the plurality of pin modules are configured to be movable along the first and second support members in the first direction, and/or the plurality of pins are configured to be movable along respective pin modules in the second direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.