Multilayer shrink film with scission layer
US10875286B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2016 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Aug 5, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2553/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Various embodiments of multilayer polymer films and multilayer structures with enhanced tear strength are provided. Also disclosed are processes and systems for producing the disclosed multilayer polymer films. The disclosed films comprise a first polymer that may be cross-linkable upon exposure to radiation, and a second polymer that is cleaved or broken when exposed to irradiation. Layers comprising the first polymer are referred to as bulk layers, and layers comprising the second polymer are referred to as scission layers. Scission layers are positioned between bulk layers. The bulk and scission layers may comprise one or more sublayers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.