Polyamide moulding compounds with low relative permittivity

US10875999B2 · kind B2 · utility

Assignee

• EMS-Patent AG · CH

Inventors

• Georg Stoppelmann · Bonaduz, CH
• Philipp Harder · Heidelberg, DE
• Etienne Aepli · Domat/Ems, CH
• Ronny Ebling · Domat/Ems, CH

Key dates

• Filing date: Nov 29, 2017
• Grant date: Dec 29, 2020
• Expiry date: Jan 6, 2038

Classification

• Technology area (CPC —): General

Abstract

Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.