Wirebonding for side-packaged optical engine
US10877231B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2018 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Feb 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/4809
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure is drawn to wirebonding for optical engines having side-mounted optoelectronic components. An integrated circuit is mounted on a first surface of a substrate block, and an optoelectronic component is positioned on a second surface of the substrate block and is oriented to emit light in a direction parallel to a plane defined by the first surface. A wirebond is drawn between the integrated circuit and a base substrate on which the substrate block is mounted. A optoelectronic component is then contacted with the wirebond, and a portion of the wirebond between the optoelectronic component and the base substrate is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.