Haptic actuator including overmolded field member and related methods
US10877563B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 28, 2020 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Apr 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/0266
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A haptic actuator may include a housing, a coil carried by the housing, and a field member movable within the housing responsive to the coil. The field member may include a frame having opposing first and second ends, at least one magnet carried by the frame, and a first overmolded endcap coupled to the first end of the frame. The field member may also include a second overmolded endcap coupled to the second end of the frame. The haptic actuator may include a first flexure having an inner end coupled to the first overmolded endcap, and an outer end coupled to adjacent portions of the housing. The haptic actuator may also include a second flexure having an inner end coupled to the second overmolded endcap, and an outer end coupled to adjacent portions of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.