Assembly of semiconductor devices using multiple LED placement cycles
US10878733B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2016 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Sep 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/819
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a display element comprising a plurality of pixels, each comprising a plurality of sub-pixels. The method comprises undertaking, using a pick up tool, a first placement cycle (1908) comprising picking up a plurality of first, untested LED dies and placing them on a display substrate at locations corresponding to the plurality of pixels, testing (1912) the first LED emitters on the display substrate to determine one or more locations of non-functional first LED emitters, selecting one or more second tested LED dies based on a result of the test, configuring the selected one or more second LED dies to enable their pick up and placement on the display substrate and undertaking, using the PUT, a second placement cycle (2008) comprising picking up the selected one or more second LED dies and placing them on the display substrate at the determined locations of the non-functional first LED emitters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.