Electronic component and manufacturing method thereof
US10879146B2 · kind B2 · utility
2Cited by
0References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 2, 2019 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Apr 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component includes a substrate which has a first major surface on one side and a second major surface on the other side, a chip which has a mounting surface on one side and a non-mounting surface on the other side and is disposed on the first major surface of the substrate in a posture that the mounting surface faces the first major surface of the substrate, a sealing insulation layer which seals the chip so as to expose the non-mounting surface above the first major surface of the substrate, and a cover layer which covers the non-mounting surface of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.