Arrangement for subsea cooling of semiconductor modules
US10879150B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2017 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Apr 10, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An arrangement for subsea cooling of a semiconductor module. The arrangement includes a tank. The tank is filled with a dielectric fluid. The arrangement includes at least one semiconductor module. The at least one semiconductor module is placed in the tank. Each at least one semiconductor module includes semiconductor submodules and is attached to a heat sink. The semiconductor submodules generate heat, thereby causing the dielectric fluid to circulate by natural convection. The heat sink includes a first part having a first thermal resistance from the semiconductor module to the dielectric fluid. The heat sink includes a second part having a second thermal resistance from the semiconductor module to the dielectric fluid. The second thermal resistance is higher than the first thermal resistance. The heat sink is oriented such that, when the arrangement is installed, the first part is configured to lie vertically higher than the second part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.