Method of joining a surface-mount component to a substrate with solder that has been temporarily secured
US10879211B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2016 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Apr 10, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83948
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of joining a surface-mount component to a substrate includes placing a piece of solder on top of the substrate and temporarily bonding the piece of solder to the substrate with at least one temporary bond. The method also includes placing a surface-mount component on top of the substrate with a bottom face of the surface-mount component facing the substrate. The surface-mount component has at least one lateral side. The method further includes positioning the surface-mount component with the at least one lateral side proximate the piece of solder, heating the substrate and the piece of solder to a joining temperature for a time sufficient for the solder to flow into an area between the bottom face of the surface-mount component and the substrate, and cooling the substrate and solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.