Stacked sensor with integrated capacitors
US10879291B2 · kind B2 · utility
0Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2018 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Nov 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
Abstract
A three-dimensional (3D) stack is provided and includes a capacitor layer and an integrated circuit (IC) layer. The capacitor layer includes capacitors and capacitor layer connectors respectively communicative with corresponding capacitors. The IC layer is stacked vertically with the capacitor layer and is hybridized to a detector. The IC layer includes IC layer connectors respectively communicative with corresponding capacitor layer connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.