Method of producing an optoelectronic component, and optoelectronic component

US10879427B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Markus Pindl · Tegernheim, DE
• Matthias Sperl · Mintraching, DE

Key dates

• Filing date: Nov 29, 2016
• Grant date: Dec 29, 2020
• Expiry date: Jan 3, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0362

Abstract

A method of producing an optoelectronic component includes providing a carrier; securing a sheet including a wavelength-converting material on a top side of the carrier; arranging a grid structure on a top side of the sheet; arranging an optoelectronic semiconductor chip in an opening of the grid structure on the top side of the sheet; arranging a potting material on the top side of the sheet, wherein the grid structure and the optoelectronic semiconductor chip are at least partly embedded into the potting material, and a composite body including the potting material, the sheet, the grid structure and the optoelectronic semiconductor chip is formed; and detaching the composite body from the carrier.