Method of forming a metallic conductive filament and a random access memory device for carrying out the method
US10879460B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2018 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Feb 27, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2213/75
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A random access memory device (400) comprises inert-inert electrode cell (210) and inert-active electrode cell (110). The inert-inert electrode cell (210) and inert-active electrode cell (110) are connected in series in a serial connection. The inert-inert electrode cell (210) comprises a top inert electrode (200), an electrolyte (202) and a bottom inert electrode (206), the inert-active electrode cell (110) comprises a top active electrode (100), an electrolyte (102) and a bottom inert electrode (106). The bottom inert electrode (200) of inert-inert electrode cell (210) is connected with negative electrode of voltage source (300) and the top active electrode (100) of inert-active electrode cell (110) is connected with positive electrode of voltage source (300).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.