Patent · US Active

Multi-state packages

US10879883B2 · kind B2 · utility

0Cited by

4References

12Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Huanzhang Huang · Plano, US
Jikai Chen · Allen, US
Yanli Fan · Allen, US
Md Anwar Sadat · Richardson, US

Key dates

Filing date	Dec 5, 2019
Grant date	Dec 29, 2020
Priority date	—
Expiry date	Dec 5, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH03K5/2472
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

In examples, an integrated circuit package comprises a pin exposed externally to the package; at least one resistor coupled to the pin at a first end of the resistor; a first transistor coupled to the at least one resistor at a second end of the resistor and coupled to a voltage source; a second transistor coupled to the at least one resistor at the second end of the resistor and coupled to a ground connection, the at least one resistor and the first and second transistors couple at a first node, the first and second transistors are of different types; and multiple comparators, each of the multiple comparators coupled to a voltage divider network and to the pin.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.