Circuit board having a predetermined punch area and sheet separated from the same
US10880993B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2020 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Jun 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes a substrate, a first measurement mark and a second measurement mark, the first and second measurement marks are located on a predetermined punch area of the substrate. After punching, the predetermined punch area is removed such that the circuit board has a through hole and a sheet is separated from the circuit board. By the first and second measurement marks on the sheet, a first distance between a first edge of the sheet and the first measurement mark and a second distance between a second edge of the sheet and the second measurement mark can be measured to determine whether the through hole is shifted or has an incorrect size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.