Immersion cooling module and electronic apparatus having the same
US10881020B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2019 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Sep 2, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic apparatus including a box body, at least one heat generating element and an immersion cooling module are provided. The immersion cooling module includes a condensing structure and an airflow guiding device. The box body has a containing space, and the containing space is adapted to contain a heat dissipation medium. The heat generating element is disposed in the containing space to be immersed in the heat dissipation medium which is in the liquid state. The condensing structure is disposed in the containing space and includes a first condensing portion. The airflow guiding device is disposed in the box body and is adapted to guide the heat dissipation medium which is in the gaseous state toward the first condensing portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.