Efficient heat removal from electronic modules
US10881028B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2019 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Jul 3, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/0264
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module includes an operational subunit, having upper, lower and lateral surfaces, and including one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation. A heat sink is disposed in proximity to the lower surface of the operational subunit. A heat spreader, including a continuous sheet of a heat-conducting material, is folded to wrap around the operational subunit so that a lower side of the sheet is interposed between the lower surface of the operational subunit and the heat sink and a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.