Heatsink with retention mechanisms
US10882147B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2018 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Dec 10, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Examples described herein include an assembly. The assembly may be a heatsink assembly or some other cooling assembly (for example, a liquid cooling assembly). The heatsink or cooling assembly may include a heatsink or some other cooling means, such as a liquid cooling device. The heatsink or cooling assembly may include a base. The heatsink itself may connect to a base or the bottom of the heatsink may form the base. The base may interface or connect to a bolster plate. The base may interface or connect to a bolster plate via apertures in the base and fasteners included on the base and the bolster plate. The heatsink or cooling assembly may include one or more apertures to accept one or more guide pins and/or retention pins on the bolster plate. The base may include retention mechanisms positioned over the apertures to attach to retention pins on the bolster plate. The retention pins may be the guide pins with retention features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.