Microchip affixing probe and method of use
US10882258B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2017 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Jan 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54413
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided among other things is a method of affixing a small, single chip to a plastic item, the chip having a top surface having length and width dimensions, and having a height, the method comprising: (1) vacuum adhering a top-oriented surface of the chip to a probe of outer dimensions comparable to or smaller than those of the length and width; (2) conveying heat to the chip via the probe such that a bottom-oriented surface of the chip is sufficiently hot to melt the plastic; (3) applying via the probe the chip to the plastic such that the chip embeds in the plastic; and (4) releasing the chip from the probe, wherein the largest of the length and width is about 500 microns or less, and height is no more than about the smallest of length and width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.