Liquid ejection head, method for producing liquid ejection head, and liquid ejection apparatus
US10882314B2 · kind B2 · utility
1Cited by
14References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2019 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Oct 16, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/18
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A liquid ejection head and its manufacturing method are capable of reducing the thickness of a protective layer as compared to the traditional technique so as to efficiently transfer the heat energy generated by a heating resistance element to a droplet of liquid such as ink. To achieve this, power supply wirings are provided in the same layer below the heating resistance element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.