Laminate, and element comprising substrate manufactured using same
US10882957B2 · kind B2 · utility
2Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2018 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Mar 28, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31736
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for producing a device substrate by obtaining a laminate comprising a carrier substrate with a first polyimide film disposed on at least one surface of the carrier substrate, a second polyimide film disposed on the first polyimide film, applying a physical stimulus to the second polyimide film without causing chemical changes in the first polyimide film such that the adhesive strength of the first polyimide to the second polyimide film decreases and separating the second polyimide film from the first polyimide film formed on the carrier substrate to obtain the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.