Catalyst ink for three-dimensional conductive constructs
US10883005B1 · kind B1 · utility
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11Claims
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Key dates
| Filing date | Mar 19, 2020 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Mar 19, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of constructing conductive material in arbitrary three-dimensional (3D) geometries, such as 3D printing. The method may include selective application of an aerosol-based colloidal solution containing a catalytic palladium nanoparticle material onto a substrate and then immersion of the coated substrate into an electro-less plating bath for deposition of conductive copper material. The above steps may be repeated to create arbitrary 3D geometric constructs containing conductive metallic patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.