Plating processing method of gripping surface of gripping tool, and gripping tool
US10883186B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 27, 2018 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Feb 22, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12056
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating processing method of a gripping surface of a gripping tool includes: temporarily and evenly fixing a plurality of first diamond grains having a uniform first grain diameter; adhering the first diamond grains by depositing a metal containing nickel on a gripping surface in a uniform thickness after the first diamond grains have been temporarily fixed; placing a plurality of second diamond grains having a second grain diameter on a metal surface of the gripping surface on which first diamond grains are not present; and adhering the second diamond grains by further depositing a metal containing nickel within a second plating solution on the metal surface in a uniform thickness that does not exceed the first diameter grain and the second diameter grain until a position relationship between the metal surface and the second diamond grains is not displaced even when the gripping tool is moved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.