Method of manufacturing an LED lighting assembly
US10883694B2 · kind B2 · utility
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13Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 7, 2017 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Nov 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0365
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention describes a method of manufacturing an LED lighting assembly, which method comprises the steps of preparing a flexible carrier for a number of light-emitting diodes; mounting the light-emitting diodes onto the flexible carrier; providing a flexible shaping element made of a material that can be bent into a desired shape or form and incorporating a heat spreader; and winding the flexible carrier about the flexible shaping element in a helical manner. The invention further describes such an LED lighting assembly, and an LED lighting unit comprising such an LED lighting assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.