PCI express tunneling over a multi-protocol I/O interconnect
US10884965B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2019 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Aug 19, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2213/0026
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Described are embodiments of methods, apparatuses, and systems for PCIe tunneling across a multi-protocol I/O interconnect of a computer apparatus. A method for PCIe tunneling across the multi-protocol I/O interconnect may include establishing a first communication path between ports of a switching fabric of a multi-protocol I/O interconnect of a computer apparatus in response to a peripheral component interconnect express (PCIe) device being connected to the computer apparatus, and establishing a second communication path between the switching fabric and a PCIe controller. The method may further include routing, by the multi-protocol I/O interconnect, PCIe protocol packets of the PCIe device from the PCIe device to the PCIe controller over the first and second communication paths. Other embodiments may be described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.