Merging multiple compute nodes with trusted platform modules utilizing authentication protocol with active trusted platform module provisioning
US10885197B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2018 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Mar 3, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F9/4401
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
Method, apparatus, and computer program product are provided for merging multiple compute nodes with trusted platform modules (TPMs) utilizing an authentication protocol with active TPM provisioning. In some embodiments, compute nodes are connected to be available for merger into a single multi-node system. Each compute node includes a TPM accessible to firmware on the node. One compute node is assigned the role of master compute node (MCN), with the other node(s) each assigned the role of slave compute node (SCN). Active TPM provisioning in each SCN produces key information that is sent to the MCN to enable use of a challenge/response exchange with each SCN. A quote request is sent from the MCN to each SCN. In response to receiving the quote request, a quote response is sent from each respective SCN to the MCN, wherein the quote response includes slave TPM content along with TPM logs and associated signatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.