Patent · US Active

Production of a multi-chip component

US10886145B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

Osram OLED GMBH · DE

Inventors

Michael Zitzlsperger · Regensburg, DE
Tobias Gebuhr · Regensburg, DE
Stephan Eicher · Arnstorf, DE

Key dates

Filing date	Jan 26, 2017
Grant date	Jan 5, 2021
Priority date	—
Expiry date	Jan 26, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0364
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of producing a surface-mountable multi-chip component includes providing a chip arrangement including a metallic conductor structure exposed at a rear side, a plurality of semiconductor chips and an housing material; and forming a solder stop coating on a rear side of the chip arrangement, wherein the solder stop coating separates connection regions of the conductor structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.