Patent · US Active

Heat transfer plate

US10886191B2 · kind B2 · utility

0Cited by

1References

8Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Reiner Holp · Winterlingen, DE
Adolf Dillmann · Trier, DE
Stefan Huehner · Tübingen, DE

Key dates

Filing date	Dec 11, 2015
Grant date	Jan 5, 2021
Priority date	—
Expiry date	Jun 11, 2036

Classification

Technology area (CPC F)Mechanical Engineering; Lighting; Heating
CPC primaryF28F2275/12
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a method for producing an assembly (1), in particular a power electronics unit, comprising the following steps: providing a component (2) to be cooled having a first surface (4), providing a cooling device (3) having a second surface (5) opposite the first surface (4), arranging a 3-dimensional heat transfer plate (6) between the two surfaces (4, 5), wherein the heat transfer plate (6) extends in a plate plane (11) parallel to the two surfaces (4, 5) and in the initial state a plurality of contact extensions (9) which extend outwards with respect to said plate plane (11), and bracing the component (2) and the cooling device (3) relative to one another, such that the contact extensions (9) are deformed in the direction of the metal sheet.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.