Semiconductor device
US10886213B2 · kind B2 · utility
0Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2020 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Aug 4, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/40
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a coil and wirings under the coil. In addition, a distance between the upper face of the wirings and the bottom face of the coil is 7 μm or larger, and the wirings have a plurality of linear wiring parts each wiring width of which is 1 μm or smaller. In addition, the linear wiring parts do not configure a loop wiring, and the coil and the linear wiring parts are overlapped with each other in planar view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.