Hybrid wafer-to-wafer bonding and methods of surface preparation for wafers comprising an aluminum metalization
US10886249B2 · kind B2 · utility
3Cited by
9References
40Claims
0Family size
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Key dates
| Filing date | Apr 30, 2018 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Apr 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/018
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface treatment solution includes a fluoride source; a first solvent; and a water transforming agent to transform water produced during wafer surface treatment into a second solvent, which can be the same as, or different from, the first solvent. The solution can be used, for example, in surface preparation for wafers having a backend including an electrical interconnect that includes aluminum or an aluminum alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.