Semiconductor device package
US10886449B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 30, 2019 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | May 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/036
Abstract
Disclosed herein is a semiconductor device package including: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed on the cavity; and an adhesive layer which fixes the light transmitting member to the body, wherein the cavity includes a stepped portion on which the light transmitting member is disposed, the stepped portion includes a first bottom surface and a third bottom surface spaced apart from each other in a first direction, a second bottom surface and a fourth bottom surface spaced apart from each other in a second direction perpendicular to the first direction, a first connecting portion in which the first bottom surface and the second bottom surface are connected to each other, a second connecting portion in which the second bottom surface and the third bottom surface are connected to each other, a third connecting portion in which the third bottom surface and the fourth bottom surface are connected to each other, and a fourth connecting portion in which the fourth bottom surface and the first bottom surface are connected to each other, the adhesive layer includes a first edge portion, a second edge portion, a third…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.