Array substrate and display panel comprising fracture opening for blocking carrier transportation between adjacent sub-pixels

US10886492B2 · kind B2 · utility

Assignee

• BOE Technology Group Co., Ltd. · CN

Inventors

• Xiaohu Li · Beijing, CN
• Zhiqiang Jiao · Beijing, CN
• Tun Liu · Beijing, CN
• Huajie Yan · Beijing, CN
• Hongsheng Zhan · Beijing, CN
• Liangliang Kang · Beijing, CN

Key dates

• Filing date: May 1, 2019
• Grant date: Jan 5, 2021
• Expiry date: May 1, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K2102/351

Abstract

An array substrate and a manufacturing method thereof, and a display panel are disclosed. The array substrate includes a base substrate, comprising a plurality of sub-pixel regions and inter-sub-pixel regions between adjacent sub-pixel regions; and a first organic functional layer on the base substrate. At least a portion of the first organic functional layer is in the plurality of sub-pixel regions; and the first organic functional layer includes at least one fracture opening, the at least one fracture opening is configured to block a transportation of the carriers between adjacent sub-pixel regions.