Crimp connection terminal
US10886637B2 · kind B2 · utility
0Cited by
12References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 8, 2019 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Oct 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/16
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a conductor crimping portion 3, a pair of crimping pieces 3c and 3d having a two-layer structure of an upper layer plate 3a and a lower layer plate 3b connecting the upper layer plate 3a is raised in a U-shape from both sides of a bottom portion 3e. A void 3g is formed inside a folded-back portion of the upper layer plate 3a from the lower layer plate 3b. In the conductor crimping portion 3, the crimping pieces 3c and 3d have a two-layer structure, and a conductor portion is elastically fixed and connection becomes strong due to the presence of the void 3g.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.