Haptic actuator including thermally coupled heat spreading layer and related methods
US10886821B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2018 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Jan 3, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K2209/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A haptic actuator may include a housing that includes a ferromagnetic material having a first heat conductance, and a coil carried by the housing in a medial portion thereof and generating waste heat when electrically powered. The haptic actuator may also include a field member movable within the housing responsive to the coil. The field member may include at least one permanent magnet establishing a magnetic path with the housing. A heat spreading layer may be thermally coupled to the housing adjacent the coil. The heat spreading layer may have a second heat conductance greater than the first heat conductance to spread the waste heat from the coil to adjacent portions of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.