Reduced-size guided-surface acoustic wave (SAW) devices
US10886893B2 · kind B2 · utility
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21Claims
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Key dates
| Filing date | Feb 21, 2019 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Feb 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/6489
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Reduced-size guided-surface acoustic wave (SAW) resonators are disclosed. Guided-SAW resonators can achieve high acoustic coupling and acoustic quality Q, but may have a larger surface area compared with a traditional temperature compensated (TC)-SAW resonator. In an exemplary aspect, a guided-SAW device is fabricated with a metal-insulator-metal (MIM) capacitor to produce a guided-SAW which has the same high Q with a surface area which is the same or less than traditional TC-SAW resonators.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.