Printed circuit board
US10887983B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2019 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Apr 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.