Silicon-titanium dioxide-polypyrrole three-dimensional bionic composite material based on hierarchical assembly and use thereof
US10888855B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2016 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Oct 30, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02W10/37
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The invention relates to a three-dimensional bionic composite material based on refection elimination and double-layer P/N heterojunctions. The preparation method of the composite material comprises: (1) anisotropically etching a silicon wafer with an alkaline solution, to form compactly arranged tetragonal pyramids on the surface of the silicon wafer; (2) performing hydrophilic treatment on the silicon wafer, growing TiO2 crystal seeds on the surface of the silicon wafer, and calcining the silicon wafer in a muffle furnace; (3) putting the silicon wafer obtained in the step (2) into a reaction kettle, and growing TiO2 nano-rods on the side walls of silicon cones by a hydrothermal synthesis method; and (4) depositing PPY nano-particles on the TiO2 nano-rods. The composite material has good refection elimination performance and efficient photogenerated charge separation capability, and is applicable in fields of photo-catalysis, photoelectric conversion devices, solar cells and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.