Molding apparatus and process
US10889026B2 · kind B2 · utility
0Cited by
24References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2017 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Mar 17, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2317/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding process (100) comprising the step of inserting an uncured blank (102) in a mold cavity (14) formed in a mold system, the uncured blank including fiber and uncured binder, transferring heat from the mold system to a cool pressurized gas (108) to establish a hot pressurized gas, injecting the hot pressurized gas into the mold cavity (110), and transferring heat (112) from the hot pressurized gas to the uncured blank to cause the uncured binder to cure and establish a cured product (114).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.