Method of curing a polymeric form and curing device for polymeric materials using thermal expansion
US10889031B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2016 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Apr 16, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/3261
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention is related to a method and an apparatus for curing a polymeric form. The method includes arranging an uncured polymeric form within a curing chamber (60) formed by a base member (20) and a constraining member (40). A thermal expansion member (30) is additionally positioned within the curing chamber (60) with the uncured polymeric form (70) such that the thermal expansion member and the uncured polymeric form are positioned between the base member (20) and the constraining member (40). The thermal expansion member (30) is heated to expand in size into an expanded state. In the expanded state the thermal expansion member (30) applies pressure to the uncured polymeric form (70) within the curing chamber. The expansion of the thermal expansion member (30) is maintained to maintain the application of pressure to the uncured polymeric form while the uncured polymeric form is being cured to form a cured polymeric form.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.