Resin film, substrate for printed wiring board, and printed wiring board
US10889086B2 · kind B2 · utility
0Cited by
1References
6Claims
0Family size
Assignees
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Key dates
| Filing date | Mar 20, 2018 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Mar 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0358
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resin film according to one aspect of the present invention is a resin film having polyimide as a main component, the resin film including a modified layer formed in a depth direction from at least one side of the resin film; and a non-modified layer other than the modified layer, wherein a ring-opening rate of an imide ring of the polyimide in the modified layer is higher than a ring-opening rate of an imide ring of the polyimide in the non-modified layer, and an average thickness of the modified layer from the one side of the resin film is greater than or equal to 10 nm and less than or equal to 500 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.