Flexible sensor and method for manufacturing the same
US10889088B2 · kind B2 · utility
1Cited by
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7Claims
0Family size
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Key dates
| Filing date | May 10, 2018 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Jun 17, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01B2202/06
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure provides a flexible sensor and a method for manufacturing the same. The flexible sensor comprises: a substrate layer formed of flexible and plastic rubber; a conductive layer located on the substrate layer; a conductive contact and a passivation layer located on the conductive layer; and a wire which is connected to the conductive layer via the conductive contact and is used for conducting induced current.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.