Wound package construct
US10889403B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2016 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Jul 7, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D85/72
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A wound package construct includes a first wound strip of package material that establishes an inner liner layer, a second wound strip of material that establishes an intermediate bodystock layer, and a third wound strip of material or cover strip that covers a seam formed by the wound bodystock layer but that does not cover all of the outer surface area of the wound bodystock layer. Therefore, the width of the cover strip is less than the width of the bodystock strip. As a result, the cover strip is not wide enough to cover the entire outer surface of the wound bodystock layer such that, after the cover strip is wrapped to cover the spiral bodystock seam, areas of the bodystock layer remain exposed between the two opposed length-wise edges of the cover strip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.