Patent · US Active

Rheology modifiers for encapsulating quantum dots

US10889675B2 · kind B2 · utility

0Cited by

0References

10Claims

0Family size

Assignees

Rohm and Haas Electronic Materials LLC · US
DOW GLOBAL TECHNOLOGIES LLC · US

Inventors

Zhifeng Bai · Midland, US
Jake Joo · Somerville, US
James C. Taylor · Grafton, US
Liang Chen · Midland, US
Valeriy V. Ginzburg · Midland, US
Jessica Ye Huang · Lake Jackson, US
Christopher J. Tucker · Midland, US

Key dates

Filing date	May 12, 2017
Grant date	Jan 12, 2021
Priority date	—
Expiry date	May 27, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08K2201/001
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A polymer resin comprising: (a) quantum dots, (b) a compound of formula (I) (I) wherein R1 is hydrogen or methyl and R2 is a C6-C20 aliphatic polycyclic substituent, and (c) a block or graft copolymer having Mn from 50,000 to 400,000 and comprising from 10 to 100 wt % polymerized units of styrene and from 0 to 90 wt % of a non-styrene block; wherein the non-styrene block has a van Krevelen solubility parameter from 15.0 to 17.5 (J/cm3)1/2.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.