Polyamide moulding compound and moulded articles produced therefrom
US10889713B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2018 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | May 4, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a polyamide moulding compound formed from a mixture of partially crystalline, aliphatic polyamides and partially crystalline, partially aromatic polyamides and also fibrous reinforcing materials. The partially crystalline, partially aromatic polyamides are thereby formed from a diamine component, a dicarboxylic acid component and possibly a lactam- and/or ω-amino acid component. The mixture and/or the moulding compound can include further components. Moulded articles produced from these moulding compounds are used, for example, in the automobile sphere, in the household sphere, in measuring, regulating and control technology or in mechanical engineering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.