Curable composition, cured object, overcoat film, coated flexible wiring board, and process for producing same
US10889729B2 · kind B2 · utility
0Cited by
1References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 17, 2016 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Apr 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable composition for forming an overcoat film for flexible wiring boards, the curable composition being effective in improving adhesion to substrates, low warpage, flexibility, the property of inhibiting wire breakage, and long-term reliability. The curable composition according to the present invention comprises a polyurethane (component a) having carboxyl groups and an aromatic-ring concentration of 0.1-6.5 mmol/g and containing an organic residue derived from a polyisocyanate, a solvent (component b), and a compound (component c) having two or more epoxy groups in the molecule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.