Superconformal filling composition and superconformally filling a recessed feature of an article
US10889908B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2018 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Dec 25, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Superconformally filling a recessed feature includes: contacting the recessed feature with superconformal filling composition that includes: Au(SO3)23− anions; SO32− anions; and Bi3+ cations; convectively transporting Au(SO3)23− and Bi3+ to the bottom member of the recessed feature; subjecting the recessed feature to an electrical current to superconformally deposit gold from the Au(SO3)23− on the bottom member relative to the sidewall and the field, the electrical current providing a cathodic voltage; and increasing the electrical current subjected to the field and the recessed feature to maintain the cathodic voltage between −0.85 V and −1.00 V relative to the SSE during superconformally depositing gold on the substrate to superconformally fill the recessed feature of the article with gold as a superconformal filling of gold, the superconformal filling being void-free and seam-free.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.