Photosensitive resin composition and cured film prepared therefrom
US10890846B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2016 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Mar 13, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/162
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition introduces a siloxane polymer containing a fluorine atom which has strong water-repellency into a composition including a common siloxane polymer and an epoxy compound, and fluorine groups may be present in the whole region of the cured film so that the water-repellency due to a fluorine component may be maintained even after removing the surface of the cured film is removed via a dry etching process. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximizes to provide a cured film having excellent stability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.