Method for forming metal pattern, and electric conductor
US10892065B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 19, 2015 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | May 23, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/015
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a method for forming a metal pattern on a pattern formation section set in a part or the whole of a region on a base material, the base material including a fluorine-containing resin layer on a surface including at least the pattern formation section, the method including the step of: forming a functional group on a pattern formation section of the fluorine-containing resin layer by a treatment such as ultraviolet-ray irradiation, then applying to the surface of the base material a metal fine particle dispersion liquid in which metal fine particles protected by an amine compound as a first protective agent and a fatty acid as a second protective agent are dispersed in a solvent, and fixing the metal fine particles on the pattern formation section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.