Heat dissipation apparatus and method for power semiconductor devices
US10892208B2 · kind B2 · utility
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Key dates
| Filing date | Oct 19, 2017 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Oct 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/112
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved heat dissipation apparatus for limiting the temperature of multiple power semiconductors featuring flow balancers to manipulate the hydrodynamic pressure of the coolant fluid to regulate the coolant fluid flow distribution across the heat exchange fins to either create uniform flow distribution or purposefully disproportionate or custom coolant fluid flow distribution for the purpose of achieving higher heat transfer efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.